Global Sources
EE Times-Asia
Stay in touch with EE Times Asia
EE Times-Asia > Processors/DSPs

Femtocell baseband to integrate DSP core

Posted: 05 Sep 2008 ?? ?Print Version ?Bookmark and Share

Keywords:femtocell? baseband? DSP?

Percello Ltd has licensed the Ceva-TeakLite-III DSP core for the development of its next-generation femtocell baseband chipsets.

"When selecting a DSP for our next-generation of cost-effective femtocell processors, the Ceva-TeakLite-III DSP emerged as the optimal solution, providing the ideal feature set and power/performance balance for our requirements," said Shlomo Gadot, CEO, Percello.

"Femtocells are believed to have a tremendous impact on the provision of wireless voice and data services in the next few years and Percello's technology may address the ongoing demand with their advanced wireless infrastructure processors," said Gideon Wertheizer, CEO, Ceva.

"The latest selection of our DSP cores for femtocell applications shows our continued expansion into new markets beyond mobile handsets," he added.

Percello was established in 2007 to practically target baseband ICs for 3G/HSDPA/HSUPA/HSPA+/LTE femtocells.

Its first device, PRC6000, will be the first in the company's Aquilo family. Initial chips are expected to be available for mass production in 1H 09.

- John Walko
EE Times Europe

Article Comments - Femtocell baseband to integrate DSP ...
*? You can enter [0] more charecters.
*Verify code:


Visit Asia Webinars to learn about the latest in technology and get practical design tips.

Back to Top