Global Sources
EE Times-Asia
Stay in touch with EE Times Asia
EE Times-Asia > Manufacturing/Packaging

German gov't backs 32nm mask litho project

Posted: 09 Sep 2008 ?? ?Print Version ?Bookmark and Share

Keywords:Germany 32nm project? mask lithography? chip production?

The Advanced Mask Technology Center (AMTC), Vistec Semiconductor Systems and the German metrology institute PTB have entered a joint R&D project aimed at developing technologies and measurement processes for next-generation chip production.

The project CDuR32 (Critical Dimensions and Registration for 32nm Mask Lithography) is funded in part by the German Federal Ministry of Education and Research. Of the total budget of 16.7 million euros (about $24.3 million), the government contributes 7.9 million euros ($11.38 million).

The project, planned for duration of two-and-a-half years, aims at developing mask technologies for the 32nm memory chip and the 22nm microprocessor generations for production in Dresden over the coming years. The AMTC is a joint venture of Advanced Micro Devices Inc., Qimonda AG and Toppan Photomasks Inc. The project is in line with the goals of the EU's ENIAC research support program.

Within the program, AMTC will analyze and develop the basic principles of manufacturing 32-/22nm photomasks. Vistec will develop the next-generation measurement system, called LSM IPRO5, to meet the requirements of qualifying mask structures. The PTB will contribute its measurement capabilities and new mathematical analysis methods to solve mask quality issues.

- Christoph Hammerschmidt
EE Times Europe

Article Comments - German gov't backs 32nm mask litho p...
*? You can enter [0] more charecters.
*Verify code:


Visit Asia Webinars to learn about the latest in technology and get practical design tips.

Back to Top