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Compact HDMI interface hastens board assembly capacity

Posted: 11 Sep 2008 ?? ?Print Version ?Bookmark and Share

Keywords:HDMI? board assembly? interface?

NXP Semiconductors has released what it claimed as the industry's first fully integrated interface conditioning chips for the HDMI 1.3 port. The new chips render 8KV of ESD protection (based on the IEC61000-4-2 standard), as well as display digital channel (DDC) buffering, hot plug control, an enable signal for HDMI port switching and CEC ringing prevention. The NXP IP4777CZ38 chip, designed for sources such as DVD players, and the IP4778CZ38 chip, designed for sinks such as TV sets, also offer ultralow line capacitance to ensure high signal integrity for the latest video formats such as 1080p.

NXP's IP4777CZ38 and IP4778CZ38 HDMI interface conditioning chips each integrates 30 to 50 discrete components, helping designers to reduce PCB space, design time and total system cost, and enabling manufacturers to boost their board assembly capacity by reducing throughput time.

"Many customers are asking for a reduction of device count on the board," said Kai Neumann, product line manager for integrated discretes, NXP Semiconductors. "By offering a fully integrated HDMI 1.3 interface conditioning solution with an integration level of 30 to 50 components, we enable our customers to have their newest designs faster in the market with a lower assembly bill. The consumers will benefit from the high International Electrotechnical Commission (IEC) ESD protection level and the option to connect long HDMI cables to audio-visual equipment," he added.

Integrated functions for IP4777CZ38 and IP4778CZ38:

? ESD protection of transition minimized differential signaling, hot plug, DDC and CEC lines based on the strict IEC standard. Since HDMI is a hot-plug interface, ESD protection becomes essential with a new series of mobile HDMI devices having several plug events each day. IP4777CZ38 and IP4778CZ38 protect the sensitive HDMI system chip against ESD pulses according to the tough IEC61000-4-2, Level 4 standard, since this gives the most realistic representation of a person touching an interface under real-life situations.

?DDC capacitive decoupling and EMI filtering between system side and HDMI connector side and buffering to drive cables with high capacitive load (>700pF). This protects TV set manufacturers from unjustified returns caused by consumers employing out-of-spec cables.

? Very high diode switching speeds and low-line capacitances of 0.7pF to ground and 0.05pF between the channels to have signal integrity, giving easy and relaxed board layout to enable designers to speed up time-to-market of their new modules
? Hot plug control for direct connection to system GPIO optimized for sources (IP4777CZ38) or sinks (IP4778CZ38)

? CEC ringing prevention through slew rate limiter back-drive protection

? Provide signal for DDC and hot plug for multiplexing and back-drive protection.

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