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TDK churns out low-profile, low ESL multilayer capacitor

Posted: 16 Sep 2008 ?? ?Print Version ?Bookmark and Share

Keywords:capacitor multilayer? ESL? chip ceramic low profile?

TDK Corp. has developed and started mass production of three low-profile, low ESL multilayer ceramic chip capacitors (0816 size, 1005 size, and 0510 size) that are just 0.3mm high (0.35mm max.), about 40 percent slimmer than earlier TDK products.

In conjunction with the development in recent years of smaller and lighter electronic devices with advanced functions and higher speeds such as PCs and mobile phones, electrical circuits have also become more compact with higher degrees of integration and use higher frequencies. There are also strong calls for lower power consumption, and there is a movement towards ICs and LSI that run on low voltage. As a result, compact, high-capacity, low ESL multilayer ceramic chip capacitors with outstanding high-frequency properties are increasingly being used as decoupling capacitors to control voltage variations. Recently, even lower-profile capacitors have become necessary.

TDK responded to these market needs by using its specialized materials and multilayering technologies to develop low-profile, low ESL multilayer capacitors that are 40 percent slimmer than earlier TDK products with the same characteristics. These products make possible 40 percent reductions in volume and weight compared to previous products and meet the need for compact components with smaller mounting footprints.

In light of these properties, TDK expects that the products will be used in ultramobile PCs and other mobile information terminals, contributing to reductions in the number of components used, space savings, and product miniaturization.





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