Global Sources
EE Times-Asia
Stay in touch with EE Times Asia
?
EE Times-Asia > T&M
?
?
T&M??

Next-generation embedded packaging solution rolls

Posted: 22 Sep 2008 ?? ?Print Version ?Bookmark and Share

Keywords:solution packaging? embedded? IMB Imbera?

Imbera Electronics introduces its next generation integrated module board (IMB) technology, available across Imbera's full range of turnkey manufacturing services. IMB technology allows OEMs/ODMs to produce smaller boards, quickly and in a cost-effective manner by making simple adaptations to existing manufacturing processes, says the company. The advanced packing solution already has considerable momentum, with early customer-wins including a contract with Ibiden, the world's number one PCB manufacturer.

Imbera's manufacturing process combines PCB manufacturing, component packaging and component assembly into a single manufacturing sequence. The benefit of this shortened process means less materials and equipment are needed, logistics are simplified and less labour is required, claims the company. Imbera adds that all this leads to a robust technology that provides further product miniaturization with very competitive total cost of ownership.

Due to its novel and advanced manufacturing process, IMB technology can be used to embed components inside a module substrate and manufacture a typical multichip module/SIP product. Alternatively IMB technology can be used to embed the components inside a motherboard to manufacture a system-in-board product. The technology can be utilized in various applications from simple products with only a few components to demanding products, such as mobile phones and other portable products requiring high packaging density as well as good electrical and thermal performance.





Article Comments - Next-generation embedded packaging s...
Comments:??
*? You can enter [0] more charecters.
*Verify code:
?
?
Webinars

Seminars

Visit Asia Webinars to learn about the latest in technology and get practical design tips.

?
?
Back to Top