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WiMAX femtocell SoC slashes design cost barriers

Posted: 24 Sep 2008 ?? ?Print Version ?Bookmark and Share

Keywords:WiMAX? femtocell? wireless 4G?

Fabless wireless chip designer DesignArt Networks has released its second chip in its SoC platform architecture, targeting WiMAX femtocells.

The company said the DAN2200, a single-chip femtocell SoC, will help equipment makers to shatter the unit price barrier of femtocells below the elusive $100.

This fits designs that seek to provide nonblocking WiMAX femtocell capacity for up to 25 simultaneous subscribers.

Joachim Hallwachs, VP, marketing, DesignArts, said the software manipulation of the 4G platform architecture and high integration means a complete femtocell design based on the DAN2200 that will consume less than 5W of total power, while providing plenty of spare processing power to run embedded high-capacity networking and media streaming applications.

"The chip shows the next level of integration and cost reduction that is available with our software-focused multicore architecture within the range of 4G options," said Hallwachs.

The company's SoC architecture and the first chip that integrates backhaul capability with WiMAX and Long Term Evolution base station functions were announced in June this year. He added that there are already numerous design wins for the company in WiMAX base stations and backhaul systems, but would not divulge the identity of the OEMs.

There are eight CPU's on the DAN platform and three ARM9 cores, with a total of 750MIPS processing power, while below it is a wireless network processor based a Tensilica Xtensa LX2 to handle PHY and MAC functions.

For the 2200, there is a 2 x 2 digital baseband for the femtocell PHY-FE. The chip is claimed to be significantly more compact than the 2400, about a quarter the size.

Reference designs using the latest part are available now and volume shipments are scheduled by Q1 09.

- John Walko
EE Times Europe





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