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Slim MEMS oscillator targets memory modules

Posted: 25 Sep 2008 ?? ?Print Version ?Bookmark and Share

Keywords:MEMS? crystal oscillator? memory module?

Claimed as the world's thinnest MEMS oscillator at 0.25mm, this new device is targeted at applications such as smart cards, ultrathin cellphones, system-in-package modules, flash storage units and other multichip modules.

SiTime Corp. said it unstacked two dies in its previous SiTime8002 MEMS oscillator, reducing it to one-third from its previous thickness, but increasing its surface area.

"This oscillator is the thinnest by almost three times," said Piyush Sevalia, VP, marketing, SiTime. The company claimed previous to this device, there was 0.7mm.

SiTime's SiT8002 used die stacking to combine the mechanical MEMS die and its ASIC, but the new SiT8002XT puts the two die side-by-side. The new chip measures 3.5mm x 3mm, but is only 0.25mm thick compared to 0.85mm previously.

The four-pad XLLGA package used for the SiT8002XT can be factory programmed in less than 48hr at frequencies between 1MHz and 125MHz, voltages between 1.8V and 3.3V and either 100 or 500 parts per million frequency tolerance.

Samples are available now. Production quantities are scheduled Q4 08.

- R. Colin Johnson
EE Times

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