Mapper, TSMC delve into multiple e-beam lithography

Mapper Lithography and Taiwan Semiconductor Manufacturing Co. have signed an agreement, according to which Mapper will ship its first 300mm multiple-electron-beam maskless lithography platform for process development and device prototyping to TSMC. This platform gives TSMC the opportunity to take the next step forward in exploring multiple e-beam technology as a lithography option at 22nm and more advanced process nodes.

Multiple e-beam maskless lithography uses over 10,000 electron beams working in parallel to directly write circuit patterns on a wafer, eliminating the need for the costly photomasks used in current lithography machines.

"This is another huge step forward for Mapper", said the company's CEO, Christopher Hegarty. "We first demonstrated proof of principle of our massively parallel electron-beam maskless lithography technology concept in September 2007. In the near future we will be shipping our first 300mm platform. We are very proud of this achievement. Having TSMC, the leading semiconductor foundry, as our launching customer for this project is a great honor for us. Their order also is a clear demonstration of TSMC's expectation of our solution. Our whole team is fully committed to turning this opportunity for 22nm manufacturing into a mature technology."

Jack Sun, vice president of R&D of TSMC said: "Mapper's technology holds great promise for cost-effective manufacturing at 22nm and beyond. We are therefore going to test Mapper's solution to see whether it will live up to its promise. Using this first tool we will be able to explore its viability for manufacturing. Mapper's solution is a serious candidate to become the future lithography standard."