Tiny ESD protection device suits up for speedy data lines

NXP Semiconductors touts the world's smallest ESD protection device for very fast data lines in an Ultra-Thin Leadless Package (UTLP) which, according to the company, achieves industry-lowest clamping voltage in a leadless package. Targeted at high-speed interfaces such as the HDMI 1.3 port, the new device, IP4281CZ10, delivers 8kV of contact ESD protection (level 4 according to the IEC61000-4-2 standard). At the same time, says NXP, its reference solution will keep the impedance dip in TDR measurements small to make impedance matching easy. The design friendly "pass through" signal routing is saving design time and board space up to 90 percent.

Key enhancements in NXP's latest ESD protection device (IP4281CZ10) include:

1. All pads are matched to 0.5mm traced high-speed lines such as TMDS (HDMI) and ML (DisplayPort), for easy impedance matching and integration
2. HDMI1.3a compliant
3. 4-channel UTLP10 package for highest board space optimization compared to 2-channel or 8-channel solutions
4. Smallest package (1mm x 2.5mm x 0.5mm)
5. Pb-free and RoHS compliant

NXP's IP4281CZ10 ESD protection device for high-speed interfaces is available immediately.