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Infineon, Micron see beyond 128Mbyte HD-SIM cards

Posted: 05 Nov 2008 ?? ?Print Version ?Bookmark and Share

Keywords:card HD-SIM? NAND? 128Mbyte memory?

Infineon Technologies AG and Micron Technology Inc. are teaming up for the development of high-density subscriber identity module (HD-SIM) cards reaching beyond 128Mbyte. Both companies are leveraging their respective expertise to architect modular chip solutions that combine an Infineon security microcontroller with Micron's innovative NAND flash memory with features designed specifically for HD-SIM applications. Micron will manufacture the NAND on 50nm and 34nm process technology. The joint solution is designed to be efficiently integrated into HD-SIM cards and will enable these cards to effectively reach beyond 128MByte of capacity and offer a host of other new features.

HD-SIM cards are ideal for delivering expanded storage and greater services for mobile applications while improving the operator's processes. Combining high density with improved security enables operators to offer graphically-rich, value-added services such as mobile banking and contactless mobile ticketing. Further, operators can securely update or delete applications through their wireless network while new applications, services and settings can be downloaded or pushed to the HD-SIM at any time to maintain fast time-to-market.

Prototypes are expected to be available in fall of 2009 and will be sold in die form or in an economic chip card IC package.





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