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Flexible termination on MLCCs reduce cracking

Posted: 02 Dec 2008 ?? ?Print Version ?Bookmark and Share

Keywords:multilayer ceramic capacitor? flexible termination? board assembly?

KEMET Corp. has announced that it now offers flexible termination (FT-CAP) in cap sizes 1808 through 2225 in X7R dielectric.

"Larger case size ceramic chips can be vulnerable to cracking due to shear stresses that may be produced during board assembly and handling," explained Corey Antoniades, associate technical marketing manager for KEMET. "The flexible termination solution now offered by KEMET on our larger case size MLCCs [multilayer ceramic capacitor] minimizes cracking during product assembly and adds to our flexible termination portfolio. This has been an issue in the past, so these new products offer our customers a valuable flex mitigation solution."

Flexible terminations add pliability to the end termination, minimizing the transfer of board flex stress to the component body. The FT-CAP is a surface mount MLCC that incorporates a unique and flexible termination system. Integrated with KEMET's standard termination materials, a conductive epoxy is placed between the conductive metallization and nickel barrier finish establishing pliability while maintaining terminal strength, solderability and electrical performance. This technology directs board flex stress away from the ceramic body and into the termination area. As a result, this termination system mitigates the risk of low-IR or short-circuit failures associated with component cracking due to board flex.

The FT-CAP complements the company's "Open Mode," "Floating Electrode (FE-CAP)" and "Flexible Termination with Floating Electrode (FF-CAP)" product lines with a complete portfolio of flex solutions.

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