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austriamicrosystems brisks up ASIC prototyping

Posted: 09 Dec 2008 ?? ?Print Version ?Bookmark and Share

Keywords:ASIC service prototyping? wafer multi-project? process CMOS?

austriamicrosystems AG has announced to enhance its ASIC prototyping service. The company increases the number of wafer starts for multi-project wafers.

In multi-project wafers, chip designs from different customers are combined onto one wafer to reduce the costs for prototype manufacturing. In particular, the high costs for the lithography masks can be shared using this method.

For its 0.18?m high-voltage CMOS process, the company now plans to offer three prototyping runs over the year. For its 0.35?m CMOS process acquired from Taiwan Semiconductor Manufacturing Co. Ltd, austriamicrosystems will offer 16 runs. While the 0.18?m high-voltage process aims at power management devices for mobile handsets, PDAs and other mobile devices, the 0.35?m BICMOS process is more suited for RF circuits operating at frequencies of up to 10GHz. But the company also offers processes for power management devices, sensor and sensor interfaces, and industrial and automotive applications.

For the year 2009, the company said it plans to offer a total of more than 150 MPW start dates.

- Christoph Hammerschmidt
EE Times-Europe





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