Global Sources
EE Times-Asia
Stay in touch with EE Times Asia
EE Times-Asia > Manufacturing/Packaging

Surface mounting technology assembly guidelines for Fairchild’s microcouplers

Posted: 15 Dec 2008 ?? ?Print Version ?Bookmark and Share

Keywords:technology optocoupler? surface technology mounting? use assembly?

Optocoupler technology, consisting of a light source and a photosensitive detector surrounded by a transparent light pipe housed in an epoxy plastic package, has been around for the last 30-40 years. Traditional optocouplers offer insulation safety and electrical signal isolation between input and output. However, today�s DC/DC converters demand optocouplers that are highly efficient, capable of handling higher temperatures, and available in much smaller packaging than ever before.

Fairchild�s microcoupler products are simple to handle in the assembly area and use the same assembly process as the BGA platform. Since all of the solder balls are at the edge of the microcoupler package and are visible with readily-available, bottom-side inspection equipment, costly and time-consuming X-ray inspection could be dropped from the inspection process altogether. In addition, the microcouplers meet the new Pb-free requirements.

View the PDF document for more information.

Article Comments - Surface mounting technology assembly...
*? You can enter [0] more charecters.
*Verify code:


Visit Asia Webinars to learn about the latest in technology and get practical design tips.

Back to Top