Solder reflow guide for surface mount device

This application note provides general guidelines for a solder reflow and rework process for Lattice surface mount products. The data used in this document is based on IPC/JEDEC standards. Each board has its own profile, which depends on the reflow equipment used and the board design. The PCB must be individually characterized to find the reliable profile. This document covers both the SnPb Eutectic process and the Pb-free process.

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