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Ubiquisys readies ZoneGate upgrade

Posted: 16 Jan 2009 ?? ?Print Version ?Bookmark and Share

Keywords:processor femtocell? upgrade ZoneGate device? femtocell W-CDMA?

Femtocell specialist Ubiquisys Ltd is readying an upgrade of its ZoneGate residential and enterprise device that will use processors from both picoChip, the company's traditional supplier of SoCs, and from Israeli group Percello.

The W-CDMA-focused femtocell will be ready for trials in the 2H 10, Will Franks, founder and CTO of Ubiquisys told EE Times-Europe, a tough design target as neither the PC302 from picoChip nor Percello's first chip, the PRC6000 are yet in silicon.

Franks said the addition of T-Mobile backed Percello as a chip supplier is customer driven, "since they and we also want and feel more confident with a diversity of supply to reduce risks."

He stressed the two broadband chips will have some different functionalities and capabilities to serve different segments of the emerging femtocells market. The next-generation ZoneGate will, for instance, be able to support 8 and 16 lines.

According to Shlomo Gadot, Percello's CEO, the companies have been working together for about 12 months to ensure the tightly integrated PRC6000 will support the advanced functionality of the next ZoneGate femtocell. These functions include cognitive radio technology that provides smart interference management, a pre-requisite for commercial mass deployment.

He added that since Ubiquisys has one of the most mature of femtocell software stacks, this has helped in defining the final design of the company's SoC.

Rupert Baines, VP of marketing at picoChip, said: "Ubiquisys has been a very important customer of ours in the femtocells business, and we have been working together closely for about five years. We are delighted that they will use our latest 302 part in the next generation femtocell, and of course understand that it is a highly competitive business out there."

Better performance
Baines said the major enhancements in the 302 are its tight integration and cost optimization, and thus lower BOM, its robust and proven silicon, as well as improved performance in terms of data rates and increased functionality.

"The experience we have in previous silicon for femtocells and the debugging that will be captured in the 302 will make the part a very reliable one for carrier class products."

- John Walko
EE Times-Europe





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