Partners to push phase change memory development

Aixtron AG and Ovonyx Inc. have agreed to cooperate on the qualification of atomic vapor deposition (AVDR) process technology to further advance scaling of next-generation phase change memory (PCM) products. As flash and DRAM both encounter increasing scaling challenges in the face of shrinking chip geometries, PCM is widely considered a practical alternative for future commercial, high-volume semiconductor memory.

"We look forward to working with AIXTRON to develop conformal deposition processes that will further enhance the commercialization of PCM products by worldwide chipmakers," said Tyler Lowrey, president and CEO of Ovonyx.

"PCM is on the verge of commercial adoption using conventional sputter physical vapor deposition techniques. However, it is clear that subsequent generation PCM cells would significantly benefit from atomic vapor deposition of phase change materials to further increase scalability and accelerate cost reductions," said Bernd Schulte, executive vice president and chief operating officer of Aixtron. "We believe that, working with Ovonyx, we can accelerate commercialization of AVDR phase change material deposition into high volume production and offer chip manufacturers higher productivity and low cost of ownership solution."