Global Sources
EE Times-Asia
Stay in touch with EE Times Asia
?
EE Times-Asia > Manufacturing/Packaging
?
?
Manufacturing/Packaging??

Good news, bad news over at Qimonda

Posted: 06 Feb 2009 ?? ?Print Version ?Bookmark and Share

Keywords:technology Buried Wordline? DDR3? memory module 46nm?

Qimonda AG has announced it has created the first operational DDR3 Buried Wordline memory modules based on the latest 46nm technology. If implemented in 46nm, the number of chips will triple compared with the current 75nm technology, boosting production efficiency 200 percent, claims the company. Furthermore, preliminary results show that power consumption will be reduced by up to 75 percent.

Remarked Thomas Seifert, CFO and COO of Qimonda, "We are confident that our new technology is the key innovation for us to move onwards into a lucrative future. The first successful test runs with the new 46nm module generation and the customer feedback up to now has been very encouraging."

According to Qimonda, the Buried Worldline technology will become a key element of its global restructuring and cost-reduction program. Moreover, in order to streamline further its production capacities, Qimonda will be ramping down operations at the Richmond 300mm facility in the United States. Approximately 1,500 employees are affected by this restructuring measure.





Article Comments - Good news, bad news over at Qimonda
Comments:??
*? You can enter [0] more charecters.
*Verify code:
?
?
Webinars

Seminars

Visit Asia Webinars to learn about the latest in technology and get practical design tips.

?
?
Back to Top