Global Sources
EE Times-Asia
Stay in touch with EE Times Asia
?
EE Times-Asia > Controls/MCUs
?
?
Controls/MCUs??

45nm smart phone ICs join OMAP family

Posted: 23 Feb 2009 ?? ?Print Version ?Bookmark and Share

Keywords:OMAP45nm? processor MID ICs? smart phone market?

To answer handset manufacturers' diverse requirements in the rapidly-evolving smart phone and Mobile Internet Device (MID) markets, Texas Instruments Inc. has extended its OMAP 3 family with new 45nm products.

The new OMAP36x application processor family allows mobile device manufacturers to reuse their software investment in TI's 65nm OMAP34x processor family and deliver higher performance computing with lower power consumption. The OMAP36x family of products will offer a range of performance levelsincluding speeds up to 1GHzto address increased high performance needs of the MID market, while delivering the low power consumption required by these battery-powered products. The migration to 45nm technology will also deliver more affordable solutions for mainstream smart phones.

Here are the features and benefits of the OMAP36x family:

??45nm CMOS process technology delivers higher performance with lower power consumption vs. the OMAP34x family, including an approximately 25 percent reduction in power and 75 percent improvement in graphics performance;
??Robust multitasking platform that supports running multiple applications in parallel by simultaneously exercising the CPU, multimedia performance and 2D/3D graphics engines;
??Dedicated 2D/3D graphics hardware accelerator, enabling more immersive user interfaces and graphics for applications like realistic 3D gaming;
??Smart pixel technology via OpenGL ES 2.0 that delivers imaging capabilities through advanced reflection effects and life-like facial features;
??Supports multistandard 720p HD functionality for HD video recording and playback;
??Integrated image signal processor supporting up to 12Mpixel imaging for enhanced photographic image quality and fast shot-to-shot camera performance;
??Pre-integrated support for mobile connectivity, including TI's current and future combo WiLink Wi-Fi solutions, NaviLink GPS solutions and BlueLink Bluetooth solutions.

The OMAP36x family of products is scheduled to sample in Q3 09. These products are intended for high-volume wireless OEMs and ODMs, and are not available through distributors.

- Henri Arnold
EE Times Europe





Article Comments - 45nm smart phone ICs join OMAP famil...
Comments:??
*? You can enter [0] more charecters.
*Verify code:
?
?
Webinars

Seminars

Visit Asia Webinars to learn about the latest in technology and get practical design tips.

?
?
Back to Top