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RF/Microwave??

3G solution banks on low-cost promise

Posted: 23 Feb 2009 ?? ?Print Version ?Bookmark and Share

Keywords:3G? HSDPA? internet mobile low-cost?

EdgeLine

The latest platform from Infineon Technologies AG enables fast mobile Internet access with a cost-optimized 3G network connectivity.

According to the company, the XMM 6130 sets a new standard, offering a competitive, cost-optimized 3G solution for enhanced mobile Internet experience with higher data rates provided by 3G HSDPA. The platform is housing the X-GOLD 613, a cellular SoC, comprising of monolithically integrated 2G/3G digital and analog baseband plus power management functionality. It is manufactured in 65nm CMOS technology.

A flagship device, the X-GOLD 613 is Infineon's first baseband dedicated to the low-cost entry 3G markets. The chip caters to low-cost cellphones designs and fuses an ARM11 based MCU, rich multimedia features with dedicated interfaces for camera, display, USB, memory cards and the benefits of a 3G air interface.

The XMM 6130 platform solution meanwhile includes a reference design, a complete RF engine, an integrated Release 6 dual-mode protocol stack with a common software API layer (UTA), and the Infineon Multimedia Framework, User Interface & Application framework.

The XMM 6130 / X-GOLD 613 will sample in June 2009 and will be available in volume quantities by 1H of 2010.





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