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BiCMOS options lock in on optoelectronics

Posted: 23 Feb 2009 ?? ?Print Version ?Bookmark and Share

Keywords:option BiCMOS? FET? optoelectronics?

X-Fab Silicon Foundries discloses five new options for its 0.6?m BiCMOS technology platform, two of which deliver first-of-a-kind capabilities for the emerging and rapidly expanding optoelectronics market. The technology advancements include a cost-efficient Light Shield module that overcomes previous barriers to better protect light-sensitive areas on a chip; and a sophisticated Blue pin module with high light sensitivity. X-Fab also announced a Field Effect Transistor (FET) module for low-noise applications, and Schottky diodes with enhanced forward current capabilities. All options are available now.


The Light Shield module enables the protection of light-sensitive areas on a chip by using a special protective layer of black resistive on top of passivation. Such protection is required for the non-light-sensitive parts of optoelectronic integrated circuits, and also can be used in bare-die or chip-on-board applications to cover the entire surface of the die. In contrast to the conventional way of protecting light sensitive parts by using an additional metal layer that reflects light, creating some interference and causing parasitic capacitances, X-Fab claims its light shield layer offers very low transmission reflection; approximately 95 percent of the visible light is absorbed. The company also asserts that the Light Shield module is also more cost-effective than other approaches for protecting circuits from light.

The blue PIN module meanwhile, comes with a photodiode optimized for the blue light portion of the light spectrum is especially useful for Blu-ray applications, claims the company. In addition, X-Fab says its sensitivity for other wavelengths up to 850nm makes it ideal for applications from ultraviolet to infrared.

On the other hand, the FET module allows special transistors to be used for low-noise applications. A newly available polyimide optiona resilient barrier layer on top of the passivationcompensates for mechanical stress, or delamination, between die and package during soldering. As for the Schottky diodes, they are scaleable in layout and offer better current capability in forward mode, says X-Fab.

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