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FCI, SMIC: new 300mm flip chip allies

Posted: 18 Mar 2009 ?? ?Print Version ?Bookmark and Share

Keywords:flip chip? 300mm wafer? packaging bumping?

FlipChip International (FCI) has formed a partnership alliance with Semiconductor Manufacturing International Corp. for 300mm flip chip bumping and wafer-level packaging.

Under this strategic partnership, FCI and SMIC will jointly promote SMIC's advanced 300mm bumping fab in Shanghai's Pudong district. FCI's participation will be through its joint venture, FlipChip Millennium (Shanghai) (FCMS) and the FCI facility in Phoenix, Arizona, offering turnkey bumping services.

The two companies will also align their technology and product roadmaps for 300mm bumping solutions at a number of technology nodes, including those required for next-generation packaging such as 3D packaging and embedded die applications. Next-generation packaging can be used in mobile handsets, medical devices, automotive integrated circuits, microprocessors, graphics processors and wireless 3G integrated solutions.

"This outstanding strategic partnership confirms the strong relationship between two internationally recognized semiconductor providers and also validates the global strategic importance of wafer-level packaging and flip chip bumping for next-generation products, including 3G mobile handsets," said Bob Forcier, FCI president and CEO. "This alliance will provide the market with the most complete global bumping and wafer-level packaging service in the industry."

"We are excited to form this partnership alliance with FCI," said Chiou Feng Chen, SMIC VP of corporate marketing and sales. "The alliance offers customers the potential of a one-stop solution for wafer fabrication, bumping, probe and final test, and drop-ship service to end customers."





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