Low profile BeO package fits power IC switches
Keywords:BeO package? power switch? assembly test?
The StratEdge BeO package has a thermal conductivity of 270W/m Kelvin. The 0.205-inch diameter circular package has a BeO disk base to accommodate devices of up to 0.030 x 0.040 inches. This standard hermetic package comes with a circular metal lid with gold tin preform. The package is designed with four leads to accommodate single pole, three throw switch (SP3T) devices. The maximum assembled package height, including the lid, is 0.056 inches.
"Their small size and ability to draw a considerable amount of heat away from tiny high power devices make StratEdge's BeO packages perfect for older technology silicon diodes as well as newer silicon carbide and gallium nitride devices," said Tim Going, president and CEO of StratEdge. "We have worked with many of our clients who manufacture semiconductor switches to perfect these packages. For companies looking for a turnkey switch solution, StratEdge can obtain the devices, assemble, test, and deliver them directly to you or your customer."
StratEdge assembly services are performed at StratEdge headquarters in San Diego, CA. They include eutectic or epoxy die attach, gold or aluminum wedge-to-wedge thermosonic wire bonding, lidding, lead trimming, marking, bulk packaging, and testing.
The BeO packages are available as part of StratEdge's new high power family of products. The Power Package family features thermally enhanced packages in many shapes, sizes, and lead counts. The materials used in the packages have matched coefficients of expansion to mitigate the inherent stresses of brazing dissimilar materials together. All packages are designed for high reliability and offer excellent RF performance over the range of the device. StratEdge packages are capable of passing MIL-STD 883 fine and gross hermeticity testing and meet RoHS and WEEE compliance standards.
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