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Devices expand Dynastron image sensor lineup

Posted: 06 Apr 2009 ?? ?Print Version ?Bookmark and Share

Keywords:image sensor? CMOS 8Mpixel? modules camera?

Toshiba America Electronic Components Inc. expanded its line of Dynastron image sensor and chip scale camera modules (CSCMs) with the introduction of a new 8Mpixel CMOS image sensor and a 2MPixel CSCM in a 1/5-inch optical format. Both of these devices use Toshiba's 1.75?m image sensor process technology, which was designed to address the needs of the mobile handset market by delivering large pixel counts in a small form factor and capturing high-quality images in low-light conditions.

The 8Mpixel Dynastron image sensor (part number ET8ER4-AS) is designed for use in high-end camera phones that offer auto-focus or optical zoom capabilities. It is available in a 1/2.5-inch optical format and is optimized for low-light environments. Higher resolution is a moving target for mobile devices where two years ago a 3Mpixel image sensor was the goal, which was increased to a 5Mpixel image sensor last year. For 2009, the expectation is to improve to an 8Mpixel sensor with continued development in the coming years.

The 2Mpixel CSCM uses the Toshiba through chip via technology to allow mounting and assembly of camera components in the chip wafer during manufacturing to reduce the size by as much as 64 percent in comparison to other camera modules. It features an integrated image signal processing function to give the CSCMs more digital still capture-type functionality. The purpose for this sensor is to enable video conferencing by having the CSCM focusing on the user.

Engineering samples of the 8Mpixel image sensor are available now, with mass production scheduled to begin in Q2 09. Its sample priced at $20 each. The 1/5-inch format 2Mpixel CSCM will be in mass production in Q2 09 and is sample priced at $10 each.

- Gregory Quirk
Mobile Handset DesignLine





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