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Impact of X-ray inspection on Spansion flash memory

Posted: 23 Apr 2009 ?? ?Print Version ?Bookmark and Share

Keywords:inspection X-ray? flash memory? risks mitigation?

X-ray inspection is a commonly employed tool used to gauge the quality of solder connections on surface-mounted BGA packaged devices on circuit boards. It has been well established that semiconductor ICs can suffer damage from (dis)charging effects caused by X-ray energy. The purpose of this application note is to provide guidance on the assessment and mitigation of risks associated with X-ray inspection of Spansion flash memory components.

View the PDF document for more information.

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