Wi-Fi/HSPA solution powers Classmate PCs

The latest wireless module will also accelerate the development of the mobile computing device market, allowing more consumers to enjoy greater convenience and accessibility of the latest generation of Classmate PCs, netbooks and laptops powered by Intel Atom processor and Intel Centrino processor technology. By leveraging the unique Wi-Fi/HSPA integration capability and small size of the EM772, manufacturers will not only be able to reduce the size of the mobile computing devices, but also significantly reduce the cost of producing them.

"We are confident that the new-generation EM772 will enhance the consumer experience. Innovation continues to be the basic tenet of Huawei's growth strategy, and will allow us to tap the opportunities presented by the fast-growing laptop market.锟? said James Chen, director of marketing department, Huawei Terminals.

Hawk Min, hardware engineering team director of Intel emerging market platforms group added, "We expect future Classmate PCs with Huawei's dual-mode wireless solution will enable students in China to enjoy greater wireless connectivity. The module's small packaging size will also fit well into the thin and light netbook and notebook designs, which are a mobile trend in 2009.锟?

With a maximum uplink rate of 5.76Mbit/s and downlink rate of 7.2Mbit/s in the HSPA network environment, the EM772 will enable users to download a standard MP3 tune in less than one second. In a Wi-Fi environment, access rates can reach a maximum of 54Mbit/s, supporting the download of a high-definition movie in around one minute.

In addition, laptops embedded with the EM772 module will provide users with greater mobility, connecting them to radio networks regardless of time and location and without the need for additional devices and wires.