Global Sources
EE Times-Asia
Stay in touch with EE Times Asia
EE Times-Asia > Sensors/MEMS

MMA7660FC board mounting guidelines

Posted: 08 May 2009 ?? ?Print Version ?Bookmark and Share

Keywords:MMA7660FC? board mounting? guidelines sensor?

This application note discusses board mounting guidelines and considerations for the MMA7660FC sensor. The first topic is the minimum recommended footprint for surface mount applications. This is a critical portion of design and if not done properly can affect soldering connection interface between the board and the package. The next topic is soldering and mounting guidelines, and considerations for the DFN accelerometer sensor to a PCB. These suggested methods will minimize the stress on the package after board mount. Following these guidelines and considerations for board mounting will result in better performance from the MMA7660FC sensor.

View the PDF document for more information.

Article Comments - MMA7660FC board mounting guidelines
*? You can enter [0] more charecters.
*Verify code:


Visit Asia Webinars to learn about the latest in technology and get practical design tips.

Back to Top