Powering complex FPGA-based systems using highly integrated DC/DC ?Module regulator systems (Part 2)

Delivering 60W of power in a compact space without efficient means to remove the heat from the power supply exacerbates the already difficult task of system heat management and cooling. The DC/DC ?Module family is designed with careful attention to the layout of its internal components, package type and electrical operation, which ease thermal management of a very dense power supply circuit. The LGA package and simple layout allow 100 percent surface mountable and low profile design for maximum efficiency in air flow. This new approach in power supply design takes advantage of paralleling multiple DC/DC ?Module regulators and following a copy and paste approach in layout design, to provide a 60W power supply with minimum components while operating efficiently in a compact and low profile space.

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