TI intros PicoStar package

The ultra-thin package, about as thin as a human hair, gives system designers the option to embed silicon components inside the PCB to maximize board space. According to TI, devices in this form factor are 50 percent thinner than similar chips in traditional packages and enable smaller, thinner end equipment. The TPD2E007—a two-channel, ESD chip—is the first device available in the ultra-thin PicoStar package.

The TPD2E007 is a back-to-back diode array that allows AC-coupled data transmission without compromising signal integrity. Typically, ESD protection is mounted close to the connector on the PCB, but designers have the option to surface mount or embed the TPD2E007 into the board/connector. The ability to embed this ultra-thin device in the board allows designers to save 80 percent board space compared to typical ESD solutions, TI said.

Pricing starts at $0.20 in quantities of 1,000. The TPD2E007 is now available in a 4-pin YFM package. Additional TI devices will be developed in PicoStar packaging, such as the TPS62620 low-power DC/DC converter, which is sampling now and will be available in volume production in Q3 09.

- Ismini Scouras
eeProductCenter