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Evaluating the integrity of LGA package, 2nd level interconnect for ?Module family of products

Posted: 12 May 2009 ?? ?Print Version ?Bookmark and Share

Keywords:package LGA? interconnect? board?

A good interconnect solution provides performance and cost benefits, ease of manufacturing, and meets or exceeds industry reliability requirements for any application. When the LGA component interconnect was introduced, board level manufacturers were given the task of incorporating the new component interconnect with their existing process.

New interconnects often improve processing, but the acceptance for new interconnects can cause conflicts between the design engineers who need the new capability and manufacturing engineers who must accommodate the new package interconnect with their existing process and equipment. The LGA interconnect offers the designers better thermal and electrical performance and the manufacturing engineers the advantage of using existing equipment and processes, thus reducing both design and manufacturing development cycle times.

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