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Solder reflow attach method for high power RF devices in over-molded plastic packages

Posted: 22 May 2009 ?? ?Print Version ?Bookmark and Share

Keywords:RF transistors? packaging? RF ICs?

This application note aims to provide Freescale Semiconductor customers with a guideline for solder reflow mounting of high power RF transistors and ICs in over-molded plastic (OMP) packages. This document aids customers in developing an assembly process suitable for their design and their manufacturing operation. Each power amplifier (PA) design has its own unique performance requirements. Similarly, each manufacturing operation also has its own process capabilities. Therefore, each design and assembly may require some fine- tuning. The intent of this application note is to provide the information our customers need to establish the process that is most suitable for their design and compatible with their manufacturing operations. When designing and manufacturing PA systems, electrical, thermal, quality, and reliability factors must be considered.

View the PDF document for more information.

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