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Sonoscan to debut operator-free wafer inspection system

Posted: 02 Jun 2009 ?? ?Print Version ?Bookmark and Share

Keywords:wafer inspection? 300mm? acoustic?

Sonoscan Inc. will launch its new C-SAM series AW300 for bonded wafer inspection at Semicon West in San Francisco's Moscone Center from July 14 to July 16. The new system extends Sonoscan's Automated Wafer (AW) inspection systems.

The AW300 carries out robotic handling and acoustic imaging of bonded wafer pairs up to 300mm in diameter. Acoustic imaging is a critical step for finding tiny but lethal defects that can occur in bonded wafers. Robotic handling makes it unnecessary for human operators to handle the wafer pairs.

In addition, the AW300 uses twin transducers to scan two wafer pairs simultaneously. At the same time, the two previously scanned wafers are being dried and returned to their carriers. Four wafer pairs are thus being processed at the same time. The result is very high throughput for 300mm wafers. High operating speed, combined with very high resolution Sonoscan technology transducers, gives tremendous leverage in identifying defects that can harm both yield and reliability in wafer pairs that often contain thousands of devices.

The AW300 is integrated with an industry standard and proven Equipment Front End Module that is SECS/GEM ready, accommodates single or multiple load ports, and utilizes either vacuum or edge grip end effectors. The scanner system utilizes linear motors and is inertially balanced for vibration-free operation.





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