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Flip-Chip 300?m recommendations for audio power amplifier

Posted: 16 Jun 2009 ?? ?Print Version ?Bookmark and Share

Keywords:Flip-chip? package? audio power amplifier?

The competitive market of portable equipment, notably the mobile phone market, is driven by a challenging development of highly integrated products.

To allow manufacturers of portable equipment to reduce the dimension of their products, STMicroelectronics has developed packages with reduced size, thickness and weight in the form of the Flip-Chip CSP (Chip Scale Package).

The electrical performances of such components in Flip-Chip CSP are improved, thanks to shorter connections compared to standard plastic packages (as TSSOP, SSOP or BGA).

This Flip-Chip CSP family has been designed to fulfill the same quality levels and the same reliability performances as standard semiconductor plastic packages. That means these new flip-chip packages have to be considered as new SMDs, which will be assembled on a PCB without any special or additional process steps required. In particular, this package does not require any extra under fill to increase reliability performances or to protect the device. Furthermore, this package is compatible with existing pick and place equipment for board mounting.

The purpose of this document is to describe the Flip-Chip CSP features and to specify how ST's customers can use them. This application note addresses the following items: product description, mechanical description, packing specifications and labeling description, recommended storage and shipping instructions, soldering assembly recommendations, user responsibility and returns, changes, delivered quantity, and quality.

View the PDF document for more information.





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