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Solder reflow guide for surface mount devices

Posted: 17 Jun 2009 ?? ?Print Version ?Bookmark and Share

Keywords:guidelines solder? solder reflow? surface mount device?

This application note provides general guidelines for a solder reflow and rework process for Lattice surface mount products. The data used in this document is based on IPC/JEDEC standards. Each board has its own profile that depends on the reflow equipment used and the board design. The PCB must be individually characterized to find the reliable profile. This document covers both the SnPb Eutectic process and the Pb-Free process.

View the PDF document for more information.

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