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3M, SUSS MicroTec advance 3D packaging

Posted: 25 Jun 2009 ?? ?Print Version ?Bookmark and Share

Keywords:3D? wafer? manufacturing?

3M and SUSS MicroTec have teamed up to expand access to 3M Wafer Support System (WSS) equipment for temporary wafer bonding of ultrathin wafers required for 3D packaging.

The non-exclusive agreement authorizes SUSS MicroTec to become an equipment supplier for the 3M WSS. As such it will make and market XBC300 and CBC300 wafer bonders designed to use 3M's WSS materials such as 3M's Light-To-Heat Conversion coating and Liquid UV-Curable Adhesive. The two companies will cooperate to meet the demand for high-performance, cost-competitive process solutions for high-volume manufacturing.

3M's UV-curable adhesive for wafer bonding to glass carriers provides robust wafer support throughout wafer grinding. This is very important in the multiple high-temperature cycles required in subsequent wafer processing steps. Then the Light-To-Heat Conversion coating makes it possible to carry out low stress, room temperature debonding of the thinned wafer directly to the tape carrier. Since the wafer is supported during the entire process, warpage, stress and process complexity are reduced. 3M's WSS are already in use for high-volume production worldwide.

"The joint efforts of both companies provide 3M customers with improved support, lower overall costs and faster access to more advanced solutions for their demanding 3D packaging requirements," commented Mike Bowman, marketing development manager for 3M electronics markets materials division.

"This relationship and process offering fits nicely with SUSS MicroTec's 3D strategy to provide a flexible and modular bonding platform that can be configured to meet customers' needs," said Wilfried Bair, general manager, wafer bonder division, SUSS MicroTec.





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