Global Sources
EE Times-Asia
Stay in touch with EE Times Asia
EE Times-Asia > Manufacturing/Packaging

Ultrathin chip shielding provides flexibility

Posted: 29 Jun 2009 ?? ?Print Version ?Bookmark and Share

Keywords:RF solution? ChipShield manufacturing? chip packaging?

Autosplice Inc. has added micro formed chip shield to RF solutions for mobile phones and other portable devices. These new ChipShields provide shielding during the manufacturing of the chip packages. The shields are manufactured to ultrathin dimensions, and the tooling can be produced in a fraction of the time and at much lower costs than with traditional stamping tools.

The increasing challenges of real estate in portable devices have created demand for the next generation of shielding whether on the board or in the chip. The new Autosplice process provides greater flexibility for both the chip manufacturers and the device manufacturers to replace existing technology. Unlike spray methods, which require extensive capital investment, the ChipShield requires little to no change to the existing chip fab process. The shields are provided by Autosplice in tape and reel, and can be adapted to most pick and place equipment for installation directly onto the chip. Custom configurations can be developed and produced in short lead times to meet requirements for rapidly changing products.

"We have been developing this technology for a few years and are excited about the potential it offers to replace existing shielding methods and offer enhanced Shielding Effectiveness due to our seamless technology," said Michael Reagan, Autosplice president. "Our portfolio of RF solutions, including traditional stamped cans, shield clips and now the ChipShield, offer our customers various cost-effective solutions to meet their EMI shielding needs."

Article Comments - Ultrathin chip shielding provides fl...
*? You can enter [0] more charecters.
*Verify code:


Visit Asia Webinars to learn about the latest in technology and get practical design tips.

Back to Top