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Duo works on bonding solution for 3D packaging

Posted: 14 Jul 2009 ?? ?Print Version ?Bookmark and Share

Keywords:3D packaging? bonding solution? wafer handling?

SUSS MicroTec and Thin Materials AG are cooperating on a temporary bonding solution to be used for challenging thin wafer-handling technologies required for emerging 3D integration and packaging technologies. With this cooperation, SUSS MicroTec extends its solution portfolio for temporary bonding and thin wafer handling.

The temporary bond material of Thin Materials is capable of handling wafer processing temperatures in excess of 250C while being able to do a room temperature de-bond. This simplifies the debond process by eliminating a number of steps, thus saving time and lowering device costs. The Thin Materials process runs on SUSS MicroTec's production wafer bonder, XBC300, whose modularity and high process flexibility can easily be adapted for changing environments and processed material. The XBC300 temporary bond configurations are available for development and high volume needs.

"We are looking forward to extending this partnership and jointly supply our customers with solutions," said Franz Richter, CEO of Thin Materials.

"Thin Materials' technology for temporary bonding complements our process offering portfolio for 3D integration and packaging," added Frank Averdung, president and CEO of SUSS MicroTec.

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