Global Sources
EE Times-Asia
Stay in touch with EE Times Asia
EE Times-Asia > RF/Microwave

Integrated front-end IC cuts component count

Posted: 20 Jul 2009 ?? ?Print Version ?Bookmark and Share

Keywords:front-end IC? power amplifier? wireless?

UPG2253T6S front-end IC

NEC has released the UPG2253T6S front-end IC (FEIC) through its exclusive sales and marketing partner, California Eastern Laboratories (CEL).

The UPG2253T6S FEIC combines a power amplifier, low pass filter, and two single pole double throw switches into a single chip. By integrating these components into one die, the UPG2253T6S FEIC reduces component count, saves total BOM cost, simplifies procurement, and decreases the PCB space required for many new embedded product designs. The UPG2253T6S FEIC eliminates the need for RF component matching, which simplifies board design and reduces component count.

Applications include Bluetooth modules that are designed into notebooks, mobile phones, and headsets as well as Zigbee/802.15.4 modules, which have wide applicability in automatic meter reading, wireless security, cable replacement and lighting systems in both commercial and residential buildings.

The UPG2253T6S FEIC is housed in a 12-pin QFN package measuring 3mm x 3mm x 0.7mm. Additional features include DC: Vd = Ven = Vsm = 3.0V; Tx: Po = 19dBm; PAE = 28 percent; Idd = 95mA; 2f0 = -25dBm; and 3f0 = -40dBm. Rx: Loss = 1.5dB typical.

The UPG2253T6S FEICs are shipping now. Pricing is at $1.10 in quantities of 100,000.

- Ismini Scouras

Article Comments - Integrated front-end IC cuts compone...
*? You can enter [0] more charecters.
*Verify code:


Visit Asia Webinars to learn about the latest in technology and get practical design tips.

Back to Top