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Evaluating MEMS, ASIC chips for automotive apps

Posted: 31 Jul 2009 ?? ?Print Version ?Bookmark and Share

Keywords:MEMS ASIC? automotive? electronics verification?

AEC-Q100 does not address MEMS and unencapsulated devices. This is where the engineer designing the test plan must get creative in seeking a solid physics-of-failure-based test regime.

This article describes the technical challenges related to automotive electronics qualification and verification of a MEMS-based sensor and ASIC system. The example device is an SoC, fully calibrated, surface mount IC, which comes in one of three humidity outputs, digital, ratiometric or linear (0-1V).

Testing results presented will focus on application of the following tests: temperature-humidity bias life; temperature cycling; high-temperature operating life; early-life failure rate; ESD Human Body Model; ESD Charged Device Model; latch-up; characterization; solderability; electrical transients; and wire bond pull testing (both encapsulated and unencapsulated).

This feature shows how to adapt industry standard tests to a non-standard device, resulting in an assessment of the robustness of a MEMS-based sensor system.

Topics covered include: criteria for evaluating the quality and reliability of a MEMS-based temperature and humidity sensor to ensure reliable performance in automotive applications; assessment of electrical and environmental tests and requirements as they apply to dual silicon temperature and humidity devices; and review of MEMS system qualification results, reliability assessments and test results.

View the PDF document for more information.

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