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Fujitsu, TSMC collaborate on 28nm process

Posted: 31 Aug 2009 ?? ?Print Version ?Bookmark and Share

Keywords:Fujitsu TSMC collaboration? 28nm process? foundry?

Fujitsu Microelectronics Ltd and Taiwan Semiconductor Manufacturing Co. Ltd are collaborating on 28nm process technology. The team-up targets foundry production of Fujitsu's 28nm logic ICs and the development of an enhanced 28nm high-performance process technology using TSMC's advanced technology platform.

The collaboration extends the cooperation between the two companies on 40nm production. Initial 28nm samples are expected to ship toward the end of 2010.

This effort combines Fujitsu's strength in advanced high-speed process and low-power design technologies with TSMC's know-how in power-efficient high-performance logic/SoC process and leading-edge technology platform that is part of the Open Innovation Platform from TSMC. Extending the collaboration to 28nm will provide the opportunity for both companies to capitalize on a competitive and high-performance 28nm technology based on TSMC's 28nm technology portfolio that includes high-performance and low-power applications.

The two companies are also discussing possibilities for collaborating on advanced packaging that could include joint developments that combine Fujitsu's strengths in high-performance Pb-free and ultrahigh-pin count packaging technologies, with TSMC's strength in chip-package integration and advanced Cu/ELK interconnect.

"We are rapidly progressing in our previously-announced collaboration with TSMC on 40nm process technology, with several product designs in progress at present," said Haruyoshi Yagi, corporate senior VP of Fujitsu Microelectronics. "With this further agreement with TSMC on 28nm high-performance process technology development and production, we combine both companies' strengths to create greater value for our customers, and will further drive the growth of businesses for TSMC and Fujitsu's ASIC and ASSP core products."

"Fujitsu Microelectronics selected TSMC as a partner based in part on TSMC's unsurpassed record of developing and ramping advanced technologies. The agreement today is also a vote of confidence in TSMC's technology platforms that include design related considerations such as design kits, design flows, TSMC and 3rd party IP; robust device related documentation, processes technology excellence and backend assembly and test capabilities," said Jason Chen, VP for worldwide sales and marketing, TSMC.





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