ST-Ericsson debuts 65nm TD-HSPA modem chips

The new chip is smaller than existing products, making it easier to implement in mobile devices, and is also designed to reach significantly lower power consumption. Besides bringing size and power consumption benefits this contributes to the affordability of final devices.

This chip supports high speed broadband services on both downlink and uplink. It will enable speeds for downlink up to 2.8Mbit/s, and support uploading of content like photos, video and other files with speeds of up to 2.2Mbit/s, compared to today's 384Kbit/s. It fully complies with the 3GPP standard.

"By delivering a TD-HSPA solution in 65nm, we continue to push the boundaries of innovation in the Chinese mobile market," said Johan Pross, responsible for ST-Ericsson China and CEO of T3G. "This advanced chip will enable our customers to develop a broad range of competitive mobile devices. Chinese consumers will enjoy higher mobile broadband connection speed while reaching power consumption levels comparable with W-CDMA devices."

Commercial devices based on this chip will be available in 1H a10.

For application notes on modems click here.