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MCP memory geared for smart phones, MIDs

Posted: 10 Nov 2009 ?? ?Print Version ?Bookmark and Share

Keywords:multi-chip package? MCP memory? DRAM? NAND flash?

Micron Technologies Inc. has developed a multi-chip package (MCP) memory for smart phones, personal media players and mobile Internet devices (MIDs) that includes a 4Gbit NAND flash memory die and a 2Gbit low-power DDR die.

The 4Gbit NAND flash memory is implemented in 34nm process technology while the DRAM is implemented in a 50nm process.

The memory is being sampled to early customers and will go into mass production early in 2010. The MCP memory can support up to 8Gbits of NAND and 8Gbits of LPDDR with the inclusion of additional die but without increasing the package size.

"With Micron's 34nm 4Gbit NAND and 50nm 2Gbit LPDDR monolithic die used in this package, we are providing customers with the most advanced solution available in NAND-based MCPs," said Eric Spanneut, director of mobile memory marketing, in a statement. "By combining the industry's leading NAND and DRAM processes within our new generation of MCPs, we are able to easily accommodate the shift to high-density NAND devices as the industry progresses toward multi-function mobile devices."

In addition to its MCP portfolio, Micron also offers discrete NAND and LPDRAM parts and NANDcode software.

- Peter Clarke
EE Times Europe

For application notes on flash memories click here.





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