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Elpida, ProMOS ink DRAM foundry deal

Posted: 11 Nov 2009 ?? ?Print Version ?Bookmark and Share

Keywords:Elpida ProMOS deal? foundry? DRAM?

Elpida Memory Inc. and ProMOS Technologies have signed a DRAM foundry agreement, marking the beginning of mutually beneficial business cooperation between the two companies.

According to the agreement, Elpida will provide advanced DRAM process and product technologies to ProMOS. In exchange, ProMOS' Taichung 300mm wafer fab will provide manufacturing capacity to Elpida for the manufacturing of its advanced 1Gbit DDR3 device. Trial runs will be completed in 1H 10, and mass production will follow in 2H 10.

M L Chen, president and chairman, ProMOS, noted Elpida's leadership in the development of leading-edge DRAM technologies. "The synergistic partnership built through this agreement will combine strengths from both companies; Elpida's 1Gbit DDR3 device is among the most cost-competitive product in the industry, pairing well with ProMOS' strength in 300mm manufacturing," Chen further noted that through this agreement, ProMOS will be able to rapidly increase its capacity utilization rate at its Taichung 300mm facilities. With the recent turnaround in the DRAM market, ProMOS has embarked on the road to recovery.

"We are very pleased to enter into this foundry agreement with ProMOS," said Yukio Sakamoto, President and CEO of Elpida Memory. "We are confident that the combination of Elpida's advanced technology and ProMOS' highly-efficient, large-scale DRAM manufacturing capabilities will enable an outstanding supply of high-performance and high-quality DRAM products."





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