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Considerations for the application of land grid array (LGA) style packages

Posted: 16 Nov 2009 ?? ?Print Version ?Bookmark and Share

Keywords:land array grid? MC1320x LGA packages? alternative BGA package?

This application note describes general considerations for application of the land grid array (LGA) style packages. Freescale has introduced RF modules such as the MC1320x and MC1321x in LGA packages as an alternative package to BGA.

The LGA packages reduce the amounts of lead in finished products and are RoHS-compliant, optimized for improved RF performance for wireless applications and reduce the overall height of the package by eliminating the stand-off height associated with BGA balls. The thinner solder joint also improves thermal dissipation properties compared to BGA packages.

View the PDF document for more information.

Click here to view related datasheets.

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