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ASML, ST accelerate 28nm deployment

Posted: 08 Dec 2009 ?? ?Print Version ?Bookmark and Share

Keywords:lithography? 22nm process? SOLID project?

ASML, along with its subsidiary Brion Technologies, announces a joint development project with STMicroelectronics to speed 28nm node deployment and 22nmnode development.

The joint development project is code-named SOLID for silicon printing optimization with lithography control and integrated design. It focuses on optimizing the patterning process from design to manufacturing, extend characterization tools and methods to develop new correction/compensation techniques for reducing variability and explore breakthrough lithography solutions for manufacturing complex chips at sub-30nm nodes.

ST will work with Tachyon SMO source-mask co-optimization in tandem with ASML's advanced illumination sources, including the recently announced FlexRay programmable illuminator. Together Tachyon SMO and FlexRay will provide ST faster development cycles in R&D and faster ramp to production. Till now, ST has successfully used Brion's Tachyon OPC+ optical proximity correction and LMC lithography manufacturability check in its 45nm production.

"This joint development project combined with ASML's integrated suite of lithography products, including Brion computational solutions and the latest generation of TWINSCAN NXT scanner provides ST with computational and wafer lithography technologies that will enable us to develop optimum manufacturing solutions at 28nm and below," said Jo�l Hartmann, silicon technology development director for ST. "Furthermore this ST-ASML effort is a reinforcement of the Crolles cooperative R&D cluster, which gathers partners around the development and enabling of low-power SoC and value-added application-specific technologies. This is a perfect example of a project developed within the framework of the Nano2012 program."

"As a long-time customer of ASML, ST is an excellent partner with whom to explore and develop holistic lithography methods for creating advanced semiconductors," said Bert Koek, senior VP, applications product group at ASML.

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