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Thermal management for FPGAs

Posted: 21 Dec 2009 ?? ?Print Version ?Bookmark and Share

Keywords:thermal management? FPGA? requirements thermal?

As IC process geometries shrink and FPGA densities increase, managing power becomes increasingly difficult. The dilemma for design groups is how to fit in all the functions the market demands without exceeding power budgets. Although power has been a third- or fourth-order concern for most FPGA designs, it is now an important concern for designs at 90nm and below. The more power a device consumes, the more heat it generates. This heat must be dissipated to maintain an optimal operating temperature.

This application note provides the information you need to determine the thermal requirements for your application. The factors you must consider include evaluating the characteristics of the printed circuit board being used, determining the need for a heat sink, determining which heat sink to use, and selecting an appropriate thermal interface material.

View the PDF document for more information.

Click here to view related datasheets.

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