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64Gbyte NAND flash packs dedicated controller

Posted: 21 Dec 2009 ?? ?Print Version ?Bookmark and Share

Keywords:NAND flash? embedded? SDRAM?

Toshiba Corp. and Toshiba America Electronic Components Inc. (TAEC) have introduced a 64Gbyte embedded NAND flash memory module, claimed to achieve the highest capacity yet in the industry.

The chip is the flagship device in a line-up of six new embedded NAND flash memory modules that offer full compliance with the latest e-MMC standard, and that are designed for application in a wide range of digital consumer products, including smart phones, mobile phones, netbooks and digital video cameras.

The new 64Gbyte embedded device combines sixteen pieces of 32Gbit (equal to 4Gbyte) NAND chips fabricated with Toshiba's 32nm process technology, and also integrates a dedicated controller. Toshiba is the first company to succeed in combining 16 pieces of 32Gbit NAND chips, and applied advanced chip thinning and layering technologies to realize individual chips that are only 30?m thick. Full compliance with the JEDEC/MMCA Version 4.4(V4.4) standard for embedded MultiMediaCards supports standard interfacing and simplifies embedding in products, reducing development burdens on product manufacturers.

Toshiba offers a comprehensive line-up of single-package embedded NAND flash memories in densities ranging from 2Gbyte to 64Gbyte. All integrate a controller to manage basic control functions for NAND applications, and are compatible with the latest e-MMC standard and its new features, including defining multiple storage areas and enhanced security features.

Demand continues to grow for embedded memories with a controller function that minimizes development requirements and eases integration into system designs. Toshiba has established itself as an innovator in this key area. The company was first to announce a 32Gbyte e-MMC-compliant device, and is now reinforcing its leadership by being first to market with a 64Gbyte generation module.

"The e-MMC interface has become the most widely embraced embedded NAND solution with a built-in controller to simplify integration into system designs. With the addition of higher density, Ver 4.4 e-MMC compliant product offered as single package solutions or as part of a multi-chip module combined with DRAM, Toshiba can help designers reduce memory subsystem space requirements," said Scott Beekman, business development manager, mobile communications memory for TAEC.

Toshiba e-MMC Ver 4.4 devices are available in a standard configuration with the NAND flash and built-in controller or in a multi-chip module (MCP) with DRAM or other memory to reduce the memory subsystem requirement to one chip. Toshiba MCPs offer multiple memory technologies such as NAND Flash, NOR Flash, Pseudo SRAM (PSRAM), and low-power SDRAM in a single package to simplify layout and save valuable board space in increasingly complex, feature-rich cellphones.

The JEDEC/MMCA V4.4-compliant interface handles essential functions, including writing block management, error correction and driver software. It simplifies system development, allowing manufacturers to minimize development costs and speed up time to market for new and upgraded products.

The high-capacity 64Gbyte embedded devices can record up to 1,070 hours of music at a1 28Kbit/s bit rate, 8.3 hours of full spec high definition video and 19.2 hours of standard definition video. The new chips support the advanced partitioning and security of e-MMC V4.4. Multiple storage areas can be configured, including several enhanced memory areas for system files or code, and a MLC area for data storage. The new 64Gbyte product is sealed in a small FBGA package, which is 14mm x 18mm x 1.4mm and has a signal layout compliant with JEDEC/MMCA V4.4.

Samples of the 64Gbyte module are available from today, and mass production will start in Q1 10.

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