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SEMI: China could double IC production in 10 years

Posted: 11 Jan 2010 ?? ?Print Version ?Bookmark and Share

Keywords:China IC production? government stimulus? fab?

The national government is investing in various VLSI equipment and materials research projects totaling $2.6 billion. In 2009, there were 54 projects involving process technology, equipment, materials, parts and other semiconductor manufacturing research funded by the government.

Focus areas included 90nm production, 65nm pilot line manufacturing, and 45nm technology, as well as other front-end and back-end manufacturing research through 2012. The National Science and Development Plan 2008-2020 will continue to focus on core electronics research, including software and increasingly high-end chip hardware.

The commitment to closing the chip gap will make the China equipment and materials market increasingly more important for global suppliers.

According to the SEMI World Fab Forecast, total spending on front end fabs (construction and equipping) in China will grow by about 67 percent in 2010 to over $2 billion. This includes new, used equipment and any self-made equipment purchased at over 20 fabs.

Installed capacity is expected to grow by about 10 percent to over 1.5 million wafers per month, about 10 percent of all worldwide capacity in 2010. In 2011, the equipment is expected to reach $2.56 billion, according to SEMI 2009 Consensus Forecast.

In materials, China is projected to spend $3.75 billion in 2010, up 15 percent from 2009, surpassing Europe and nearly approaching the levels of U.S. spending (SEMI 2009 Consensus Forecast).

- EE Times Europe


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