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Large-capacity FPGA packs higher I/O count

Posted: 15 Jan 2010 ?? ?Print Version ?Bookmark and Share

Keywords:FPGA? I/O count? ASIC?

Xilinx Inc. is now shipping the Virtex-6 LX760 device, claimed to be the largest FPGA currently available.

The Virtex-6 LX760 is available for delivery with immediate design tool support, enabling customers to get started on their projects today by using the company's ISE Design Suite 11.4.

The Virtex-6 LX760 device is suited for applications that require intensive computational performance and high logic density. The large-capacity device enables designers to use a single-FPGA to prototype or emulate a greater range of ASIC designs than ever before, the company said.

In addition to high logic capacity, the LX760 device offers a higher I/O count than competing FPGAs to simplify the challenge of partitioning a large ASIC netlist across multiple FPGAs. The ISE Design Suite version 11.4 reduces compile time by 30 percent to enable large, according to the firm.

The Virtex-6 LX760 device packs 1,200 I/O pins and 25,920Kbits of Block RAM embedded memory. The LX760 device is optimized to tradeoff high-speed serial transceivers for higher I/O, logic and embedded memory capacity.

A Xilinx spokesperson said the company has been shipping other Virtex-6 devices for a few months, including the LX130T, LX195T and LX240T.

- EE Times

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