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EDA/IP??

Does EDA need international roadmap?

Posted: 22 Jan 2010 ?? ?Print Version ?Bookmark and Share

Keywords:EDA? international EDA roadmap? R&D? TVS?

Joseph Borel, ex-executive VP in central R&D at STMicroelectronics NV confirms that the EDA industry has a roadmap, with Europe continually renewing the Medea+ EDA roadmap. However, the real question should be: Does the EDA industry need an international roadmap?

"Does the EDA industry have a roadmap? My answer to this question is definitely YES," emphasized Borel, now at the JB-R&D EDA consulting company, to EDA DesignLine. "Europe has an EDA roadmap, and has had it for several years within European programs, established on my initiative, under my responsibilities and in collaboration with all European players."

Indeed, Europe has been in a continuous EDA roadmapping process with the definition of its annual global R&D programs.

"Europe is ahead in terms of EDA roadmapping. This may be explained by the fact that EDA business remains small in Europe, and also because U.S. companies tend to acquire our startups' accomplishments. It is high time that we change this situation with the advent of new technology approaches such as TSV (through-silicon via)."

Borel attracted the attention on The European EDA Roadmap 2009, a 352-page document that he and twenty European industry and R&D contributors wrote for the timeframe 2008 to 2013.

In more specific terms, The 2009 European Roadmap for design automation in semiconductor products describes mainly SoC and SiP products, taking the best of technology capabilities for addressing new markets. The 2009 edition mainly focuses on demonstrating a complete top-down design flow, starting at specifications, then system level design linking designers to formal customer's specification, parametrizable IPs creation, standards and design for manufacturability (DFM) supported by new TCAD (Technology CAD) developments.

Published mid-2009, the document is revised and expanded with new ideas, notably CAD linked to DFM, SIP (using new technology approaches such as TSV for 3D stacking), security and reliability (dependability), every year.

Borel indicated that Chinese contacts called for the translation of the European EDA Roadmap 2009 in their language.


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