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TMS320C6474 hardware design guide

Posted: 11 Feb 2010 ?? ?Print Version ?Bookmark and Share

Keywords:hardware system design? TMS320C6474 device? hardware design?

This application note is intended to aid in the hardware design and implementation of a C6474-based system.

If the DDR2 interface is used, there are specific recommendations for the BGA pad and pin escape vias given in TMS320C6474 DDR2 Implementation Guidelines (SPRAAW8). Given the 0.80mm-pitch, it is recommended that non-solder mask defined (NSMD) PCB lands be used for mounting the device to the board. With the NSMD method, the land area is etched inside the solder mask area. While the size control is dependent on copper etching and is not as accurate as the SMD method, the overall pattern registration is dependent on the copper artwork, which is quite accurate. The tradeoff is between accurate dot placement and accurate dot size. NSMD lands are recommended for small-pitch BGA packages because more space is left between the copper lands for signal traces.

View the PDF document for more information.

Click here to view related datasheets.





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